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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11692093 B1

PDFFull Text
Date of Patent:
Jul. 04, 2023

Filed:

Sep. 18, 2018

Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding

Applicant:

Konica Minolta, Inc., Tokyo, JP;

Inventor:

Takeshi Kojima, Tokyo, JP;

Assignee:

KONICA MINOLTA, INC., Tokyo, JP;

Attorney:

Lucas & Mercanti, LLP

Primary Examiner:

Edward J Cain

Int. Cl.
CPC ...
C08L 33/12 (2006.01); B33Y 10/00 (2015.01); B29C 64/135 (2017.01); B29C 64/371 (2017.01); C08G 18/00 (2006.01); C08G 59/02 (2006.01); C08K 3/22 (2006.01); C08K 3/30 (2006.01); C08K 3/34 (2006.01); C08K 3/40 (2006.01); C08K 7/14 (2006.01); C08K 9/06 (2006.01); C08L 33/08 (2006.01); C08L 75/04 (2006.01); C08L 83/04 (2006.01); B33Y 70/10 (2020.01); B29K 33/00 (2006.01); B29K 75/00 (2006.01); B29K 83/00 (2006.01); B29K 305/00 (2006.01); B29K 307/04 (2006.01); B29K 309/02 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
C08L 33/12 (2013.01); B29C 64/135 (2017.08); B29C 64/371 (2017.08); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); C08G 18/00 (2013.01); C08G 59/02 (2013.01); C08K 3/22 (2013.01); C08K 3/30 (2013.01); C08K 3/346 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08K 9/06 (2013.01); C08L 33/08 (2013.01); C08L 75/04 (2013.01); C08L 83/04 (2013.01); B29K 2033/12 (2013.01); B29K 2075/00 (2013.01); B29K 2083/00 (2013.01); B29K 2205/00 (2013.01); B29K 2305/00 (2013.01); B29K 2307/04 (2013.01); B29K 2309/02 (2013.01); B29K 2309/08 (2013.01); C08K 2003/2272 (2013.01); C08K 2003/3063 (2013.01);
Abstract

Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

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