The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Oct. 12, 2017
Applicant:
Dupont Polymers, Inc., Wilmington, DE (US);
Inventor:
Kai Qi, Wilmington, DE (US);
Assignee:
DuPont Polymers, Inc., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01); C08L 77/00 (2006.01); C08L 77/06 (2006.01); B29C 64/118 (2017.01); B33Y 70/00 (2020.01); D01F 6/90 (2006.01); B33Y 80/00 (2015.01); B29K 77/00 (2006.01);
U.S. Cl.
CPC ...
C08G 69/265 (2013.01); B29C 64/118 (2017.08); B33Y 70/00 (2014.12); C08L 77/00 (2013.01); C08L 77/06 (2013.01); D01F 6/90 (2013.01); B29K 2077/10 (2013.01); B33Y 80/00 (2014.12); D01F 6/905 (2013.01);
Abstract
The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.
Qi, Kai. (2023). Filament compositions for fused filament fabrication and methods of use thereof (U.S. Patent No. 11692063). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11692063
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile