The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Jul. 29, 2019
Applicant:

Essentium, Inc., Pflugerville, TX (US);

Inventor:

Charles Brandon Sweeney, Pflugerville, TX (US);

Assignee:

ESSENTIUM IPCO, LLC, Pflugerville, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/52 (2006.01); A43D 25/20 (2006.01); B29L 31/50 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4835 (2013.01); B29C 65/4855 (2013.01); B29C 65/525 (2013.01); A43D 25/20 (2013.01); B29L 2031/504 (2013.01);
Abstract

A system and method for bonding a first layer of material to a second layer of material includes a first electrically conductive plate, a second electrically conductive plate spaced apart from the first electrically conductive plate. The second electrically conductive plate is electrically grounded. A high frequency generator in electrical communication with the first electrically conductive plate supplies high frequency electrical signals to the first electrically conductive plate. An adhesive applied to one of the first and second layers of material has an electromagnetic susceptor material that when subjected to the electric field heats the adhesive to an adhesive curing temperature to bond the first layer of material to the second layer of material. A clamping mechanism applies pressure to one of the first and second layers of material to maintain contact between the first and second layers until an adhesive cure time has lapsed.


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