The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Jun. 22, 2020
Applicant:
Illinois Tool Works Inc., Glenview, IL (US);
Inventor:
Christopher Hsu, Appleton, WI (US);
Assignee:
Illinois Tool Works Inc., Glenview, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B22F 5/12 (2006.01); H05B 6/10 (2006.01); B23K 26/0622 (2014.01); B23K 26/70 (2014.01); B23K 15/00 (2006.01); B23K 9/04 (2006.01); B23K 9/167 (2006.01); B23K 35/02 (2006.01); B21C 3/08 (2006.01); B23K 35/36 (2006.01); B23K 35/40 (2006.01); C04B 35/622 (2006.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/50 (2021.01); B22F 10/66 (2021.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B23K 101/32 (2006.01); B22F 12/13 (2021.01); B22F 10/38 (2021.01); B22F 10/50 (2021.01);
U.S. Cl.
CPC ...
B22F 5/12 (2013.01); B21C 3/08 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/66 (2021.01); B22F 12/50 (2021.01); B23K 9/04 (2013.01); B23K 9/167 (2013.01); B23K 15/0026 (2013.01); B23K 15/0086 (2013.01); B23K 26/0624 (2015.10); B23K 26/342 (2015.10); B23K 26/702 (2015.10); B23K 35/02 (2013.01); B23K 35/0222 (2013.01); B23K 35/0227 (2013.01); B23K 35/0244 (2013.01); B23K 35/0261 (2013.01); B23K 35/36 (2013.01); B23K 35/40 (2013.01); B23K 35/404 (2013.01); B23K 35/406 (2013.01); C04B 35/62277 (2013.01); H05B 6/10 (2013.01); B22F 10/38 (2021.01); B22F 10/50 (2021.01); B22F 12/13 (2021.01); B22F 2003/1053 (2013.01); B23K 2101/32 (2018.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); Y02P 10/25 (2015.11);
Abstract
Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.
Hsu, Christopher. (2023). Wire manufactured by additive manufacturing methods (U.S. Patent No. 11691198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11691198
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile