The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Jan. 15, 2019
Applicant:
Hitachi High-tech Corporation, Tokyo, JP;
Inventors:
Ichiro Miyano, Tokyo, JP;
Osamu Komuro, Tokyo, JP;
Masakazu Takahashi, Tokyo, JP;
Masashi Fujita, Tokyo, JP;
Assignee:
Hitachi High-Tech Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01F 1/153 (2006.01); H01J 37/09 (2006.01); H01J 37/28 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01J 37/09 (2013.01); H01F 1/153 (2013.01); H01J 37/28 (2013.01); H01L 21/67017 (2013.01);
Abstract
Provided is an electromagnetic field shielding plate, etc., in which it is possible to reduce weight while achieving high shielding performance from relatively high-frequency electromagnetic fields. The electromagnetic field shielding plate is configured by layering a permalloy layercomprising a plate or sheet of permalloy, and an amorphous layercomprising an Fe—Si—B—Cu—Nb-based amorphous plate or sheet.