The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
May. 26, 2021
Applicants:
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventor:
Chang Liu, Beijing, CN;
Assignees:
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 25/18 (2023.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01L 25/18 (2013.01); H05K 1/189 (2013.01); H05K 1/0346 (2013.01); H05K 1/09 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/049 (2013.01); H05K 2201/058 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01);
Abstract
A connection structure configured to connect a display panel and a circuit board, includes a flexible printed circuit, a first chip-on-film, and a second chip-on-film. The first chip-on-film and the second chip-on-film are coupled to one end of the flexible printed circuit. The first chip-on-film and the second chip-on-film are coupled to two surfaces of the flexible printed circuit that are opposite in a thickness direction of the flexible printed circuit.