The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

May. 19, 2021
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Julian Arlo Binder, Redwood City, CA (US);

James Chester Meador, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/62 (2011.01); H01R 12/65 (2011.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01R 12/62 (2013.01); H01R 12/65 (2013.01); H05K 1/0218 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 3/28 (2013.01); H05K 3/363 (2013.01); H05K 3/365 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/049 (2013.01); H05K 2203/1322 (2013.01);
Abstract

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.


Find Patent Forward Citations

Binder, Julian. (2023). Electronic assembly that includes interconnected circuit boards (U.S. Patent No. 11688958). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688958

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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