The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Apr. 16, 2020
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Tucker McFarlane, Morrisville, NC (US);

Matthew Brady, Raleigh, NC (US);

Derek Miller, Raleigh, NC (US);

Colin Blakely, Raleigh, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01);
Abstract

Solid-state lighting devices and more particularly light-emitting devices including light-emitting diodes (LEDs) with light-altering material arrangements are disclosed. LED devices may include light-altering materials that are provided around peripheral sidewalls of LED chips without the need for a supporting submount or lead frame. The light-altering materials may be provided with reduced thicknesses along peripheral sidewalls of LED chips. An exemplary LED device as disclosed herein may be configured with a footprint that is close to a footprint of the LED chip within the LED device while also providing an amount of light-altering material around peripheral edges of the LED chip to reduce cross-talk. Accordingly, such LED devices may be well suited for use in applications where LED devices form closely-spaced LED arrays. Fabrication techniques are disclosed that include laminating a preformed sheet of light-altering material on one or more surfaces of the LED chip.


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