The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

May. 04, 2021
Applicant:

Silergy Semiconductor Technology (Hangzhou) Ltd, Hangzhou, CN;

Inventors:

Zheng Lv, Hangzhou, CN;

Huisen He, Hangzhou, CN;

Xianguo Huang, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0232 (2014.01); H01L 31/101 (2006.01); H01L 31/0216 (2014.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/186 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H01L 31/02161 (2013.01); H01L 31/02327 (2013.01); H01L 31/101 (2013.01);
Abstract

A method of manufacturing an optoelectronic integrated device can include: providing a semiconductor substrate including at least one optoelectronic device in the semiconductor substrate; forming a first dielectric layer on a first surface of the semiconductor substrate; forming a multilayer insulating layer on the first dielectric layer; forming a first opening in the multilayer insulating layer to expose the first dielectric layer above the optoelectronic device area; and forming a second dielectric layer on the dielectric layer, where the first dielectric layer and the second dielectric layer are anti-reflection layers.


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