The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Aug. 24, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Mi-Jin Kim, Suwon-si, KR;
Seong-Jun Kim, Suwon-si, KR;
Kyo-Ree Lee, Suwon-si, KR;
Tae-Sang Park, Seoul, KR;
Tack-Mo Lee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06V 10/147 (2022.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G06V 10/147 (2022.01); G06V 40/1318 (2022.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14678 (2013.01); H01L 27/14685 (2013.01);
Abstract
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.