The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Sep. 10, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masataka Kazuno, Kofu, JP;

Tetsuya Otsuki, Fujimi-machi, JP;

Hitoshi Ueno, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 25/18 (2023.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/15 (2013.01); H01L 23/3121 (2013.01);
Abstract

An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.


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