The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Aug. 31, 2022
Applicant:

Rolls-royce Deutschland Ltd & CO KG, Blankenfelde-Mahlow, DE;

Inventors:

Uwe Waltrich, Forchheim, DE;

Stanley Buchert, Herzogenaurach, DE;

Assignee:

Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H02M 7/217 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); B64D 27/24 (2006.01); B64D 35/04 (2006.01); B60L 58/00 (2019.01); B64C 29/00 (2006.01); B64D 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); B60L 58/00 (2019.02); B64C 29/0008 (2013.01); B64D 27/24 (2013.01); B64D 35/04 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H02M 7/217 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 2027/026 (2013.01);
Abstract

An electrical vertical take-off and landing (eVTOL) aircraft includes a plurality of electrical propulsion units (EPUs), each EPU having a propeller or a fan configured to be driven to rotate by an electrical motor arranged to receive electrical power from a respective power electronics converter. Each power electronics converter includes a converter commutation cell having a power circuit and a gate driver circuit, the power circuit including at least one power semiconductor switching element and at least one capacitor. At least one terminal of each power conducting switching element is connected to at least one electrically conductive layer of a multi-layer planar carrier substrate at an electrical connection side of a power semiconductor prepackage, which includes at least one electrically conductive layer located on an opposite side of the power semiconductor switching element to the electrical connection side of the power semiconductor prepackage.


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