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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11688700 B1

PDFFull Text
Date of Patent:
Jun. 27, 2023

Filed:

Jun. 11, 2021

Die package having security features

Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Jason M. Kehl, El Segundo, CA (US);

Jason G. Milne, El Segundo, CA (US);

Steve F. Mayrose, Palos Verdes Estates, CA (US);

Aaron George, Los Angeles, CA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:

Daly Crowley Mofford & Durkee, LLP

Primary Examiner:

Omar F Mojaddedi

Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 23/58 (2006.01); H01L 23/552 (2006.01); H01L 23/46 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/04 (2006.01); H01L 23/16 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 23/043 (2013.01); H01L 23/46 (2013.01); H01L 23/552 (2013.01); H01L 23/585 (2013.01);
Abstract

Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry can include conductive pillars in the protected volume and the die can include circuity to determine an impedance of the pad and the pillars for tamper detection. An edge cap can be coupled to at least one side of the assembly for tamper detection.

Find Patent Forward Citations

Kehl, Jason. (2023). Die package having security features (U.S. Patent No. 11688700). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688700

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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