The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Sep. 10, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Jun Takagi, Yokkaichi, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/306 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B24B 37/013 (2013.01); H01L 21/30625 (2013.01);
Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a polisher configured to polish a film provided on a substrate. The apparatus further includes a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing. The apparatus further includes a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module.
Takagi, Jun. (2023). Semiconductor manufacturing apparatus and method of manufacturing semiconductor device (U.S. Patent No. 11688653). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688653
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile