The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jan. 19, 2022
Applicant:

Next Biometrics Group Asa, Oslo, NO;

Inventors:

Tian Xiao, Everett, WA (US);

King Hong Kwan, Bellevue, WA (US);

Sheng-Hsiang Hung, Zhubei, TW;

Mark W. Naumann, Los Gatos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 21/84 (2006.01); B81C 1/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/561 (2013.01); H01L 21/84 (2013.01); B81C 1/00269 (2013.01); H01L 23/298 (2013.01);
Abstract

Systems and methods for manufacturing flexible electronics are described herein. Methods in accordance with embodiments of the present technology can include disposing electrical features, such as thin film circuits, on a first side of a glass substrate, applying a first protective material over the electronic features, and exposing a second side of the glass substrate to a chemical etching tank to thin the glass substrate to a predetermined thickness. The thinning process can remove cracks and other defects from the second side of the glass substrate and enhance the flexibility of the electronic assembly. A second protective material can be disposed on the second side of the thinned glass substrate to maintain the enhanced backside surface of the glass substrate. In some embodiments, the method also includes singulating the plurality of electronic features into individual electronic components by submerging the electronic assembly into a chemical etching tank.


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