The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jan. 25, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kanto Iida, Nagaokakyo, JP;

Naoki Gouchi, Nagaokakyo, JP;

Shingo Ito, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 3/46 (2006.01); H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 17/06 (2006.01); H01F 41/04 (2006.01); H04R 9/02 (2006.01); H04R 9/06 (2006.01); H01F 17/02 (2006.01); C09K 19/38 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01F 41/042 (2013.01); C09K 19/38 (2013.01); H01F 5/003 (2013.01); H01F 17/02 (2013.01); H05K 1/024 (2013.01); H05K 3/4652 (2013.01); H01F 2005/006 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/0502 (2013.01);
Abstract

A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.


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