The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jan. 31, 2013
Applicants:

Muhammad Ali Malik, Stenungsund, SE;

Christer Svanberg, Kallered, SE;

Thomas Gkourmpis, Gothenburg, SE;

Takashi Uematsu, Stenungsund, SE;

Roger Carlsson, Save, SE;

Niklas Thorn, Stenungsund, SE;

Jenny-ann Ostlund, Torslanda, SE;

Inventors:

Muhammad Ali Malik, Stenungsund, SE;

Christer Svanberg, Kallered, SE;

Thomas Gkourmpis, Gothenburg, SE;

Takashi Uematsu, Stenungsund, SE;

Roger Carlsson, Save, SE;

Niklas Thorn, Stenungsund, SE;

Jenny-Ann Ostlund, Torslanda, SE;

Assignee:

BOREALIS AG, Vienna, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 9/02 (2006.01); C08L 23/12 (2006.01); H01B 1/24 (2006.01); C08L 23/08 (2006.01); C08K 3/04 (2006.01); C08L 23/14 (2006.01); H01B 13/24 (2006.01); H01B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01B 9/027 (2013.01); C08K 3/04 (2013.01); C08L 23/0853 (2013.01); C08L 23/0869 (2013.01); C08L 23/12 (2013.01); C08L 23/14 (2013.01); H01B 1/24 (2013.01); H01B 13/24 (2013.01); C08L 2205/02 (2013.01); H01B 3/004 (2013.01); Y10T 428/2933 (2015.01);
Abstract

The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.


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