The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Apr. 24, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Min Chul Park, Hwaseong-si, KR;

Jeong Hoon Ko, Hwaseong-si, KR;

Ji Yong Park, Suwon-si, KR;

Je Hyun Lee, Suwon-si, KR;

Dae Sin Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06V 10/762 (2022.01); G06V 10/764 (2022.01); H01L 21/66 (2006.01); G06F 18/23 (2023.01); G06F 18/24 (2023.01); G06F 18/2413 (2023.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06F 18/23 (2023.01); G06F 18/24 (2023.01); G06F 18/24137 (2023.01); G06V 10/762 (2022.01); G06V 10/764 (2022.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01); G06V 2201/06 (2022.01);
Abstract

A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.


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