The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Mar. 09, 2020
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
James S. Wilson, Waltham, MA (US);
James Giesey, Waltham, MA (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 9/02 (2006.01); F28F 1/02 (2006.01); F28F 1/40 (2006.01); F28F 3/02 (2006.01); F28F 3/12 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 9/026 (2013.01); F28F 1/022 (2013.01); F28F 1/40 (2013.01); F28F 3/025 (2013.01); F28F 3/12 (2013.01); H05K 7/20254 (2013.01); F28F 2275/025 (2013.01); F28F 2275/04 (2013.01); F28F 2275/06 (2013.01);
Abstract
A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.