The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Mar. 01, 2018
Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Takahiro Maeda, Dusseldorf, DE;

Yoshiyuki Ogawa, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); H01M 8/0221 (2016.01); H01M 8/0228 (2016.01); H01M 8/0284 (2016.01); H01M 10/0525 (2010.01); C09J 7/28 (2018.01); C09J 123/16 (2006.01); H01M 50/121 (2021.01); H01M 50/119 (2021.01); H01M 50/131 (2021.01); H01M 50/124 (2021.01); H01G 9/20 (2006.01); H01L 31/048 (2014.01); H01M 50/489 (2021.01); H01M 50/193 (2021.01); H01M 50/417 (2021.01);
U.S. Cl.
CPC ...
C09J 7/381 (2018.01); C09J 7/28 (2018.01); C09J 123/16 (2013.01); H01M 8/0221 (2013.01); H01M 8/0228 (2013.01); H01M 8/0284 (2013.01); H01M 10/0525 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/131 (2021.01); C09J 2203/33 (2013.01); C09J 2301/312 (2020.08); C09J 2301/414 (2020.08); C09J 2400/163 (2013.01); C09J 2423/10 (2013.01); H01G 9/20 (2013.01); H01L 31/0481 (2013.01); H01M 50/193 (2021.01); H01M 50/417 (2021.01); H01M 50/489 (2021.01);
Abstract

A laminate for a battery with a polypropylene adhesive layer and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene-α-olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130° C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100° C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.


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