The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Feb. 13, 2020
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Timothy J. Person, Pottstown, PA (US);
Manish Talreja, Lansdale, PA (US);
Jeffrey M. Cogen, Flemington, NJ (US);
Saurav S. Sengupta, Gilbertsville, PA (US);
Assignee:
DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/06 (2006.01); C08L 23/04 (2006.01); C08F 210/02 (2006.01); B29B 7/72 (2006.01); B29B 7/00 (2006.01); B29B 7/84 (2006.01); C08K 5/00 (2006.01); C08L 23/26 (2006.01); B29B 7/90 (2006.01); C03C 25/285 (2018.01); C03C 25/30 (2018.01); D02G 3/12 (2006.01); D02G 3/36 (2006.01); D02G 3/44 (2006.01); B29B 7/38 (2006.01); H01B 3/44 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); B29B 7/007 (2013.01); B29B 7/726 (2013.01); B29B 7/728 (2013.01); B29B 7/845 (2013.01); B29B 7/90 (2013.01); C03C 25/285 (2013.01); C03C 25/30 (2013.01); C08F 210/02 (2013.01); C08K 5/005 (2013.01); C08L 23/04 (2013.01); C08L 23/26 (2013.01); D02G 3/12 (2013.01); D02G 3/36 (2013.01); D02G 3/441 (2013.01); H01B 3/441 (2013.01); B29B 7/38 (2013.01); C08L 2203/202 (2013.01); C08L 2205/025 (2013.01); C08L 2312/00 (2013.01); D10B 2401/16 (2013.01);
Abstract
Crosslinkable polymeric compositions comprising an ethylene-based polymer, an organic peroxide, and an amine-functionalized interpolymer. Such crosslinkable polymeric compositions and their crosslinked forms can be employed as polymeric layers in wire and cable applications, such as insulation in power cables.