The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jul. 30, 2019
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Masato Otsu, Chiba, JP;

Kazuo Arita, Chiba, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08L 63/00 (2006.01); B32B 15/092 (2006.01); B32B 27/38 (2006.01); C08G 59/40 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); B32B 15/092 (2013.01); B32B 27/38 (2013.01); C08G 59/4021 (2013.01); C08L 63/00 (2013.01); B32B 2457/00 (2013.01);
Abstract

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.


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