The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

May. 20, 2020
Applicant:

Gulfstream Aerospace Corporation, Savannah, GA (US);

Inventors:

Kristopher Lynch, Savannah, GA (US);

Mike Lucas, Savannah, GA (US);

Charles Roberts, II, Savannah, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 1/18 (2006.01); B64C 1/40 (2006.01); B32B 7/09 (2019.01); B32B 7/14 (2006.01); B32B 5/06 (2006.01); B32B 3/12 (2006.01);
U.S. Cl.
CPC ...
B64C 1/18 (2013.01); B32B 3/12 (2013.01); B32B 5/06 (2013.01); B32B 7/09 (2019.01); B32B 7/14 (2013.01); B64C 1/403 (2013.01); B32B 2307/10 (2013.01); B32B 2307/102 (2013.01); B32B 2471/02 (2013.01); B32B 2605/003 (2013.01); B32B 2605/18 (2013.01);
Abstract

A finished floor assembly covers a floor area of an aircraft and includes a subfloor, a padding assembly, and a finish flooring layer. Noise radiates from the subfloor due to vibrations transmitted by an aircraft structure. The padding assembly attenuates the noise and includes a first pad layer, a second pad layer, and a plurality of discontinuous couplings. The first pad layer abuts the subfloor. The second pad layer is adjacent to the first pad layer. The plurality of discontinuous couplings are laterally separated from each other along the floor area by void portions. The discontinuous couplings secure the first pad layer to the second pad layer and the first pad layer and the second pad layer are in contact at the void portions. The finish flooring layer disposed overtop the padding assembly.


Find Patent Forward Citations

Loading…