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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11685145 B1

PDFFull Text
Date of Patent:
Jun. 27, 2023

Filed:

Oct. 29, 2020

Flow path structure, liquid ejecting apparatus, liquid ejecting head, and method of manufacturing flow path structure

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yoshinori Nakajima, Matsumoto, JP;

Shun Katsuie, Matsumoto, JP;

Assignee:

Seiko Epson Corporation, Tokyo, JP;

Attorney:

Workman Nydegger

Primary Examiner:

Anh T Vo

Int. Cl.
CPC ...
B41J 2/175 (2006.01); B41J 2/14 (2006.01); B41J 2/135 (2006.01); B32B 1/08 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B41J 2/17 (2006.01);
U.S. Cl.
CPC ...
B32B 27/36 (2013.01); B29C 45/0013 (2013.01); B29C 45/0055 (2013.01); B29C 45/14008 (2013.01); B29C 45/14065 (2013.01); B32B 1/08 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B41J 2/135 (2013.01); B41J 2/14 (2013.01); B41J 2/17 (2013.01); B41J 2/175 (2013.01); B32B 2307/7242 (2013.01); B32B 2597/00 (2013.01);
Abstract

A flow path structure including a first-flow path includes a first-flow path member that including a first-resin member made of a resin and a first-film member having a film, a second-flow path member laminated on the first-flow path member and adhered to the first-flow path member, in which the first-resin member includes a first-front surface that is a surface facing the second-flow path member and that is provided with a first-recessed portion, the first-film member includes a first-surface and a second-surface that is opposite from the first-surface, at least a portion of the first-surface is in close contact with a front surface of the first-resin member inside the first-recessed portion, and the second-surface and the second-flow path member define at least a portion of the first-flow path in a region overlapping the first-recessed portion in a laminating direction of the first-flow path member and the second-flow path member.

Find Patent Forward Citations

Nakajima, Yoshinori. (2023). Flow path structure, liquid ejecting apparatus, liquid ejecting head, and method of manufacturing flow path structure (U.S. Patent No. 11685145). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11685145

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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