The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Mar. 12, 2018
Hewlett-packard Development Company, L.p., Spring, TX (US);
James R Przybyla, Corvallis, OR (US);
Jason Hower, Corvallis, OR (US);
Michael G Monroe, Corvallis, OR (US);
Galen P Cook, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
In one example in accordance with the present disclosure, an additive manufacturing module is described. The additive manufacturing module includes an agent distributor to selectively distribute a fabrication agent onto layers of build material. The agent distributor includes at least one fluidic ejection die. Each fluidic ejection die includes a plurality of nozzles arranged along a die length and a die width, the plurality of nozzles arranged such that, for each set of neighboring nozzles, a respective subset of each set of neighboring nozzles are positioned at different die width positions along the width of the fluidic ejection die. The fluidic ejection die also includes, for each respective nozzle of the plurality of nozzles, a respective ejection chamber fluidically coupled to the respective nozzle and for each respective ejection chamber, at least one respective fluid feed hole fluidically coupled to the respective ejection chamber.