The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Oct. 23, 2020
Applicant:

Utility Global, Inc., Houston, TX (US);

Inventors:

Matthew Dawson, Katy, TX (US);

Nicholas Farandos, Greystones, IE;

Jin Dawson, Katy, TX (US);

Chris Matson, Dublin, IE;

Assignee:

Utility Global, Inc., Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B22F 10/36 (2021.01); B33Y 50/02 (2015.01); B22F 3/10 (2006.01); B23K 26/03 (2006.01); B23K 26/062 (2014.01); B22F 1/052 (2022.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B22F 10/36 (2021.01); B22F 1/052 (2022.01); B22F 3/1017 (2013.01); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/034 (2013.01); B23K 26/062 (2015.10); B33Y 50/02 (2014.12); B33Y 30/00 (2014.12);
Abstract

Herein discussed is a method of heating a material having a surface comprising exposing the surface to an electromagnetic radiation source emitting a first wavelength spectrum; receiving a second wavelength spectrum from the surface using a detector at a sampling frequency; wherein the first wavelength spectrum and the second wavelength spectrum have no greater than 10% of overlap, wherein the overlap is the integral of intensity with respect to wavelength. In an embodiment, the first wavelength spectrum and the second wavelength spectrum have no greater than 5% of overlap or no greater than 3% of overlap or no greater than 1% of overlap or no greater than 0.5% of overlap. In an embodiment, exposing the surface to the radiation source causes the material to sinter at least partially.


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