The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jun. 02, 2020
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventors:

Bradley Scott Withers, El Dorado Hills, CA (US);

Yuyan Luo, El Dorado Hills, CA (US);

Erik Scott Nelson, Granite Bay, CA (US);

Brent Allan Best, Rocklin, CA (US);

Assignee:

Illinois Tool Works Inc., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A46B 9/06 (2006.01); H01L 21/67 (2006.01); A46B 9/00 (2006.01); A46D 3/00 (2006.01); B29C 45/16 (2006.01); H01L 21/02 (2006.01); A46B 13/02 (2006.01); B08B 3/10 (2006.01); B29K 31/00 (2006.01); B29L 31/42 (2006.01);
U.S. Cl.
CPC ...
A46B 9/06 (2013.01); A46B 9/005 (2013.01); A46D 3/00 (2013.01); B29C 45/1615 (2013.01); H01L 21/02057 (2013.01); H01L 21/02096 (2013.01); H01L 21/67046 (2013.01); A46B 13/02 (2013.01); A46B 2200/3073 (2013.01); B08B 3/10 (2013.01); B29K 2031/04 (2013.01); B29L 2031/42 (2013.01);
Abstract

Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.


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