The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Oct. 24, 2019
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventor:
Assignee:

Magna Electronics Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01L 23/40 (2006.01); G01S 7/03 (2006.01); G01S 7/481 (2006.01); G01S 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); G01S 7/03 (2013.01); G01S 7/4813 (2013.01); H01L 23/40 (2013.01); H05K 1/0284 (2013.01); H05K 1/144 (2013.01); H05K 7/205 (2013.01); H05K 7/20518 (2013.01); H05K 7/20854 (2013.01); G01S 7/027 (2021.05); H05K 2201/09063 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.


Find Patent Forward Citations

Loading…