The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Oct. 15, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Sung Han Kim, Suwon-si, KR;

Han Kim, Suwon-si, KR;

Young Bok Yoon, Suwon-si, KR;

Seok Hwan Kim, Suwon-si, KR;

Tae Ho Yun, Suwon-si, KR;

Kyung Ho Lee, Suwon-si, KR;

Jong Gil Won, Suwon-si, KR;

Chul Kyu Kim, Suwon-si, KR;

Jong Man Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H04N 23/68 (2023.01); H04N 23/51 (2023.01);
U.S. Cl.
CPC ...
H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H04N 23/687 (2023.01); H05K 1/0278 (2013.01);
Abstract

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.


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