The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Jul. 20, 2022
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yuji Ishimatsu, Kyoto, JP;

Ryuichi Furutani, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); H02M 3/335 (2006.01); H02M 1/32 (2007.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02M 3/33507 (2013.01); H02M 1/081 (2013.01); H02M 1/327 (2021.05); H02M 7/003 (2013.01); H02M 7/537 (2013.01);
Abstract

The power converter Aincludes a semiconductor device B, and a substrate H on which the semiconductor device Bis mounted, where the semiconductor device Bincludes a control chip constituting a primary control circuit, a semiconductor chip constituting a secondary power circuit, and a transmission circuit for electrically insulating the primary control circuit and the secondary power circuit and for signal transmission between the primary control circuit and the secondary power circuit. The substrate H has a conductive portion K. The power converter Aincludes a connecting terminal Tdisposed on the substrate H and electrically connected to the conductive portion K. The power converter Aincludes a conductive path Dthat is at least partially formed by the conductive portion K of the substrate H, and that electrically connects the primary control circuit and the connecting terminal T. Such a configuration contributes to downsizing the power converter A


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