The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
May. 27, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Eduardo Bartolome, Dallas, TX (US);
Rakul Viswanath, Bangalore, IN;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/09 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 31/08 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/09 (2013.01); H01L 21/4846 (2013.01); H01L 21/568 (2013.01); H01L 24/19 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14649 (2013.01); H01L 27/14658 (2013.01); H01L 31/085 (2013.01); H01L 31/18 (2013.01);
Abstract
In a described example, an apparatus includes: a photon detector array with a first signal output pad coupled to a photon detector array pixel; a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of the ROIC die; and the first signal output pad coupled to the first signal input pad.