The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Mar. 26, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Masaaki Shimatani, Tokyo, JP;

Shimpei Ogawa, Tokyo, JP;

Shoichiro Fukushima, Tokyo, JP;

Satoshi Okuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/028 (2006.01); H01L 27/144 (2006.01); H01L 31/109 (2006.01); H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
H01L 31/028 (2013.01); H01L 27/1446 (2013.01); H01L 31/109 (2013.01); H01L 31/112 (2013.01);
Abstract

An electromagnetic wave detector includes a light-receiving element, an insulating film, a two-dimensional material layer, a first electrode part, and a second electrode part. The light-receiving element includes a first semiconductor portion of a first conductivity type and a second semiconductor portion. The second semiconductor portion is joined to the first semiconductor portion. The second semiconductor portion is of a second conductivity type. The insulating film is disposed on the light-receiving element. The insulating film has an opening portion. The two-dimensional material layer is electrically connected to the first semiconductor portion in the opening portion. The two-dimensional material layer extends from on the opening portion onto the insulating film. The first electrode part is disposed on the insulating film. The first electrode part is electrically connected to the two-dimensional material layer. The second electrode part is electrically connected to the second semiconductor portion.


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