The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Aug. 31, 2020
Applicants:

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Lin Chen, Beijing, CN;

Chengshao Yang, Beijing, CN;

Tao Ma, Beijing, CN;

Dengfeng Wang, Beijing, CN;

Ling Han, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); G02F 1/1343 (2006.01); H10K 50/81 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H01L 27/1259 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/32134 (2013.01); H01L 27/1248 (2013.01); G02F 1/13439 (2013.01); H10K 50/81 (2023.02); H10K 71/621 (2023.02);
Abstract

The present disclosure provides a manufacturing method of a display substrate, a display substrate and a display device, belongs to the field of display technology, and can at least partially solve a problem of residual sand in the display substrate. The manufacturing method of the display substrate includes: providing a base; forming a passivation layer on a surface of the base; forming an amorphous oxide conductive material layer on a surface of the passivation layer facing away from the base; forming a photoresist pattern on the oxide conductive material layer, the photoresist pattern having an exposure region; etching a portion of the oxide conductive material layer in the exposure region of the photoresist pattern to form a hollow position exposing a portion of the passivation layer; and removing a certain thickness material of the portion of the passivation layer exposed through the hollow position.


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