The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Nov. 12, 2021
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Hyun Chul Seo, Icheon-si, KR;
Jun Sik Kim, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H05K 1/0272 (2013.01); H01L 2224/16238 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip and a package substrate. The semiconductor chip is mounted on the package substrate. The package substrate includes a dielectric layer through which a vent hole penetrates, trace patterns disposed on the dielectric layer, and a protecting block disposed between the trace patterns and the vent hole.