The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Feb. 07, 2019
Applicant:
Ford Global Technologies, Llc, Dearborn, MI (US);
Inventors:
Richard Marlow, Grimsby, CA;
Craig Brian Rogers, Belleville, MI (US);
Assignee:
FORD GLOBAL TECHNOLOGIES, LLC, Dearborn, MI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); H01L 23/49 (2013.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48245 (2013.01);
Abstract
A semiconductor assembly includes a power semiconductor, a housing containing the power semiconductor, and electrically conductive channels. The electrically conductive channels are arranged to direct coolant through the housing. Heat generated by the power semiconductor can therefore be absorbed by the coolant. The electrically conductive channels are also electrically connected with the power semiconductor to form terminals for the power semiconductor.