The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Dec. 22, 2018
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Yi Liu, San Diego, CA (US);

Anthony James Lobianco, Irvine, CA (US);

Matthew Sean Read, Rancho Santa Margarita, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Howard E. Chen, Anaheim, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/3205 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); B23K 26/38 (2014.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/32051 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/552 (2013.01); H01L 24/14 (2013.01); B23K 26/38 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.


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