The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Feb. 05, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Masaaki Mizushiro, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H01F 17/06 (2006.01); H01F 17/00 (2006.01); H01F 27/24 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 41/041 (2013.01); H01F 17/0013 (2013.01); H01F 17/062 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H05K 1/16 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil electrode included in an inductor component includes a plurality of metal pins upper end surfaces of which are exposed to the upper surface of a resin layer and lower end surfaces of which are exposed to a lower surface of the resin layer, and a plurality of wiring patterns that connect the upper end surfaces or the lower end surfaces of the predetermined metal pins, wherein surface roughnesses of the upper surface and the lower surface of the resin layer are larger than surface roughnesses of the upper end surfaces and the lower end surfaces of the respective metal pins, and wiring patterns are respectively formed on the upper and lower surfaces of the resin layer by plating.


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