The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Sep. 30, 2021
Applicant:

Ati Technologies Ulc, Markham, CA;

Inventors:

Zheng Gong, Toronto, CA;

Jiao Wang, Markham, CA;

Zhenhua Yang, Markham, CA;

Assignee:

ATI Technologies ULC, Markham, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11C 17/16 (2006.01); G11C 17/18 (2006.01); H01L 23/525 (2006.01); G11C 29/44 (2006.01); G11C 29/02 (2006.01); H01L 23/48 (2006.01); H10B 20/20 (2023.01);
U.S. Cl.
CPC ...
G11C 17/16 (2013.01); G11C 17/18 (2013.01); G11C 29/027 (2013.01); G11C 29/44 (2013.01); H01L 23/481 (2013.01); H01L 23/5256 (2013.01); H10B 20/20 (2023.02);
Abstract

An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.


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