The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Mar. 16, 2020
Applicant:

Ricoh Company, Ltd., Tokyo, JP;

Inventors:

Tohru Yashiro, Kanagawa, JP;

Kohji Takeuchi, Kanagawa, JP;

Yasuhiro Takahashi, Kanagawa, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); G02F 1/157 (2006.01); B29D 11/00 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B29K 69/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/157 (2013.01); B29D 11/00009 (2013.01); B32B 27/08 (2013.01); B32B 27/365 (2013.01); B29K 2069/00 (2013.01); B32B 2250/05 (2013.01); B32B 2307/20 (2013.01); B32B 2551/00 (2013.01);
Abstract

A laminated structure including: an electrically conductive layer; an underlying layer including a first resin and inorganic particles; a support including a second resin; and a resin layer including a third resin that is at least one selected from the group consisting of a resin of same kind as the second resin and a resin having a softening temperature equal to or lower than a softening temperature of the second resin, the electrically conductive layer, the underlying layer, the support, and the resin layer being disposed in this order.


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