The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Mar. 12, 2021
Applicants:

Arthur Fox, Murray, UT (US);

Calvin L. Simmons, Murray, UT (US);

Michael P. Sheffield, Lake Point, UT (US);

William Geoffrey Callahan, Cedar Hills, UT (US);

Inventors:

Arthur Fox, Murray, UT (US);

Calvin L. Simmons, Murray, UT (US);

Michael P. Sheffield, Lake Point, UT (US);

William Geoffrey Callahan, Cedar Hills, UT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/82 (2006.01); G01N 33/2045 (2019.01);
U.S. Cl.
CPC ...
G01N 27/82 (2013.01); G01N 33/2045 (2019.01);
Abstract

The present invention provides a way to increase the density of Hall effect sensors on a MFL inline inspection tool mounting the sensors on a first circuit board which overlies a second circuit board. Op amps for the sensors which condition and filter the analog signal from the sensors are mounted on the first circuit board. Microprocessors mounted on the second circuit board receive the analog signal from the op amp and translate it into a digital signal. Use of the stacked circuit boards doubles the amount of area to mount the sensors and their op amps and microprocessors while maintaining the same footprint. This results in being able to increase the number of Hall effect sensors in that footprint area. In other embodiments the number of layers of circuit boards may be increased beyond two.


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