The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Apr. 13, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Takakazu Hino, Ichihara, JP;

Michitaka Suto, Ichihara, JP;

Akihiro Nakamura, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 7/25 (2018.01); C08G 77/08 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 7/255 (2018.01); C09J 2203/318 (2013.01); C09J 2301/122 (2020.08); C09J 2301/208 (2020.08); C09J 2467/005 (2013.01); C09J 2483/00 (2013.01);
Abstract

A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.


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