The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Aug. 31, 2020
Applicant:
Roots Co., Ltd., Incheon, KR;
Inventors:
Assignee:
ROOTS CO., LTD., Incheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 11/08 (2006.01); B28B 11/00 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
B28B 11/0845 (2013.01); B28B 11/003 (2013.01); H01L 33/505 (2013.01); H01L 2933/0041 (2013.01);
Abstract
A method of manufacturing ceramic chips according to one aspect of the present disclosure includes: (A) forming a plurality of dicing trenches on a ceramic wafer; (B) removing a surface in which the dicing trenches are formed by as much as a predetermined thickness to eliminate a rough surface, which is formed on an outer side of each of the dicing trenches when the dicing trenches are formed; and (C) removing a surface opposite to the surface in which the dicing trenches are formed by as much as a predetermined thickness so that the wafer is individualized into a plurality of ceramic chips.