The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Aug. 27, 2020
Applicant:
Subaru Corporation, Tokyo, JP;
Inventors:
Yoichi Sato, Tokyo, JP;
Marosuke Kikuchi, Tokyo, JP;
Assignee:
SUBARU CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/04 (2006.01); B25J 11/00 (2006.01); B23P 17/02 (2006.01); B23P 13/00 (2006.01);
U.S. Cl.
CPC ...
B23P 19/04 (2013.01); B23P 17/02 (2013.01); B25J 11/005 (2013.01); B23P 13/00 (2013.01); B23P 2700/01 (2013.01); B25J 11/0055 (2013.01); Y10T 29/49726 (2015.01); Y10T 29/49748 (2015.01); Y10T 29/49762 (2015.01); Y10T 29/49813 (2015.01); Y10T 29/49861 (2015.01); Y10T 29/49895 (2015.01); Y10T 29/49996 (2015.01); Y10T 29/49998 (2015.01); Y10T 29/5138 (2015.01);
Abstract
An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.