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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11679363 B1

PDFFull Text
Date of Patent:
Jun. 20, 2023

Filed:

Mar. 01, 2021

High-pressure fluid processing device configured for batch processing

Applicant:

Microfluidics International Corporation, Westwood, MA (US);

Inventors:

Michael P. Ratigan, Scituate, RI (US);

David G. Harney, Stoneham, MA (US);

John Michael Bernard, Stoughton, MA (US);

Assignee:

MICROFLUIDICS INTERNATIONAL CORPORATION, Westwood, MA (US);

Attorney:

K&L Gates LLP

Primary Examiner:

Edward T Tolan

Assistant Examiner:

Jared O Brown

Int. Cl.
CPC ...
B02C 23/22 (2006.01); B01F 33/83 (2022.01); B02C 25/00 (2006.01); B01F 25/50 (2022.01); B02C 23/18 (2006.01); B02C 23/36 (2006.01); F04B 49/08 (2006.01); F04B 49/22 (2006.01); F04B 15/02 (2006.01); B01F 35/21 (2022.01); B01F 35/22 (2022.01); F04B 43/04 (2006.01); F04B 9/10 (2006.01); F04B 43/12 (2006.01); F04B 17/03 (2006.01); F04B 43/06 (2006.01); F04B 43/14 (2006.01); B01F 33/80 (2022.01);
U.S. Cl.
CPC ...
B01F 25/50 (2022.01); B01F 33/83 (2022.01); B01F 35/2113 (2022.01); B01F 35/2115 (2022.01); B01F 35/2209 (2022.01); B02C 23/18 (2013.01); B02C 23/22 (2013.01); B02C 23/36 (2013.01); B02C 25/00 (2013.01); F04B 15/02 (2013.01); F04B 49/08 (2013.01); F04B 49/22 (2013.01); B01F 33/8361 (2022.01); F04B 9/10 (2013.01); F04B 17/03 (2013.01); F04B 43/04 (2013.01); F04B 43/06 (2013.01); F04B 43/1238 (2013.01); F04B 43/14 (2013.01); F04B 2205/09 (2013.01); F04B 2205/10 (2013.01); F04B 2205/11 (2013.01);
Abstract

The present disclosure provides apparatuses and methods related to a high pressure processing device that is configured to simplify batch processing. In an embodiment, a high pressure processing device includes a processing module configured to reduce a particle size of a material or achieve a desired liquid processing result for the material, a pump configured to pump the material to an inlet of the processing module, a recirculation pathway configured to recirculate the material from an outlet of the processing module back to the pump, an input device configured to receive at least one user input variable, and a controller configured to (i) determine a number of pump strokes for the pump based on the user input variable, and (ii) control the pump according to the determined number of pump strokes so that the material makes a plurality of passes through the processing module.

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