The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Dec. 30, 2019
Applicant:
Depuy Synthes Products, Inc., Raynham, MA (US);
Inventors:
Sean Hamilton Kerr, Oreland, PA (US);
Ali Recber, East Greenwich, RI (US);
Thomas Pepe, West Chester, PA (US);
Dominique Messerli, Bristol, RI (US);
Lawton Laurence, Phoenixville, PA (US);
Ryan Walsh, Downingtown, PA (US);
Thomas Kueenzi, Magden, CH;
Brandon Randall, Suzhou Jiangsu, CN;
Assignee:
DePuy Synthes Products, Inc., Raynham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61L 27/56 (2006.01); A61F 2/44 (2006.01); A61N 1/362 (2006.01); C08J 9/24 (2006.01); C08J 9/26 (2006.01); A61L 27/18 (2006.01); C08G 65/00 (2006.01); A61L 27/26 (2006.01); A61L 27/50 (2006.01); A61B 17/86 (2006.01); A61F 2/28 (2006.01); A61F 2/30 (2006.01);
U.S. Cl.
CPC ...
A61L 27/56 (2013.01); A61F 2/4455 (2013.01); A61L 27/18 (2013.01); A61L 27/26 (2013.01); A61L 27/50 (2013.01); A61N 1/3622 (2013.01); C08G 65/00 (2013.01); C08J 9/24 (2013.01); C08J 9/26 (2013.01); A61B 17/86 (2013.01); A61F 2002/2817 (2013.01); A61F 2002/3008 (2013.01); A61F 2002/30062 (2013.01); A61F 2002/30064 (2013.01); A61F 2002/3092 (2013.01); A61F 2002/3097 (2013.01); A61F 2002/30317 (2013.01); A61F 2002/30387 (2013.01); A61F 2002/30426 (2013.01); A61F 2002/30578 (2013.01); A61F 2002/30604 (2013.01); A61F 2002/30841 (2013.01); A61F 2210/0004 (2013.01); A61F 2220/0025 (2013.01); A61F 2250/0098 (2013.01); A61F 2310/00796 (2013.01); A61F 2310/00976 (2013.01); A61L 2430/02 (2013.01);
Abstract
Embodiments described include devices and methods for forming a porous polymer material. Devices disclosed and formed using the methods described a spacer for spinal fusion, craniomaxillofacial (CMF) structures, and other structures for tissue implants.