The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Sep. 24, 2020
Applicant:

Dana Tm4 Inc., Boucherville, CA;

Inventors:

Benoit Blanchard St-Jacques, Sainte-Julie, CA;

Francois Dube, Montreal, CA;

Marc-Antoine Beaupre, Saint-Lambert, CA;

Assignee:

DANA TM4 INC., Boucherville, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 24/45 (2013.01); H01L 25/0655 (2013.01); H05K 1/0207 (2013.01); H05K 1/0231 (2013.01); H01L 23/3735 (2013.01);
Abstract

Methods and systems are provided for a power module. In one example, the power module may have a half-bridge configuration with electrical terminals arranged at opposite side of the power module, semiconductor chips arranged in a printed circuit board (PCB), a capacitor electrically coupled to the electrical terminals and arranged above and in contact with a top plate of the power module, and one or more connectors coupled to the PCB to couple the power module to external circuits. The power module may be directly cooled by flowing a coolant over the semiconductor chips.


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