The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

May. 28, 2021
Applicants:

Yamaichi Electronics Co., Ltd., Tokyo, JP;

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Toshiyasu Ito, Tokyo, JP;

Hui Zhang, Guangdong, CN;

Jie Zhang, Guangdong, CN;

Xiaohui Li, Guangdong, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H05K 7/10 (2006.01); H01R 43/16 (2006.01); H01R 12/71 (2011.01); H01R 33/76 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1053 (2013.01); H01R 12/716 (2013.01); H01R 33/76 (2013.01); H01R 43/16 (2013.01);
Abstract

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.


Find Patent Forward Citations

Loading…