The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Mar. 29, 2021
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Takashi Machida, Tokyo, JP;

Kazuyoshi Yamashita, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/374 (2011.01); H01L 27/14 (2006.01); H01L 27/146 (2006.01); H04N 5/232 (2006.01); H04N 5/355 (2011.01); H04N 5/369 (2011.01); H04N 5/378 (2011.01); G01S 17/931 (2020.01); G01S 7/4863 (2020.01); G01S 17/89 (2020.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H04N 5/374 (2013.01); G01S 7/4863 (2013.01); G01S 17/89 (2013.01); G01S 17/931 (2020.01); H01L 23/5223 (2013.01); H01L 27/14 (2013.01); H01L 27/146 (2013.01); H01L 27/14609 (2013.01); H04N 5/23212 (2013.01); H04N 5/355 (2013.01); H04N 5/369 (2013.01); H04N 5/378 (2013.01); H04N 5/232122 (2018.08);
Abstract

The present technology relates to a solid-state image sensor, an imaging device, and an electronic device capable of switching FD conversion efficiency in all pixels of a solid-state image sensor. A photodiode performs photoelectric conversion on incident light. A floating diffusion (FD) stores charge obtained by the photodiode. FD2, which is a second FD to which the capacity of an additional capacitor MIM is added, adds the capacity to the FD. The additional capacitor MIM is constituted by a first electrode formed by a wiring layer and a second electrode formed by a metallic light blocking film provided on a surface of a substrate on which the photodiode is formed. Switching between the FD and FD+FD2 allows switching of the FD conversion efficiency. The present technology is applicable to a CMOS image sensor.


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