The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Apr. 12, 2021
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Jiho Joo, Sejong-si, KR;

Yong Sung Eom, Daejeon, KR;

Gwang-Mun Choi, Daejeon, KR;

Kwang-Seong Choi, Daejeon, KR;

Chanmi Lee, Sejong-si, KR;

Ki Seok Jang, Sejong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/56 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/27 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 33/56 (2013.01); H01L 25/0753 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/83909 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.


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