The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Jun. 14, 2022
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Ravi Vig, Concord, NH (US);

William P. Taylor, Amherst, NH (US);

Paul A. David, Bow, NH (US);

P. Karl Scheller, Dover, NH (US);

Andreas P. Friedrich, Metz-Tessy, FR;

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); G01R 33/06 (2006.01); G01R 33/00 (2006.01); G01D 5/14 (2006.01); G01R 15/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/82 (2013.01); G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01);
Abstract

A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.


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